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DRAM pricing has roughly doubled quarter-over-quarter in Q1 2026, with PC DDR up 105–110%. SK Hynix has reportedly sold out its entire 2026 DRAM and NAND production to AI customers. Micron has done the same with HBM4 capacity. For OEMs and contract manufacturers without direct allocations from Samsung, Micron, or SK Hynix, the open-market spot price is the new reality — and that's where independent brokers matter.

DDR4 and DDR5 prices have more than doubled in many cases since late 2025, with individual memory components increasing as much as 700% above historical pricing. Lead times for memory components now run 32 to 40+ weeks, and the constraint is structural rather than temporary — AI data-center demand is consuming a growing share of global memory capacity, and manufacturers are prioritizing higher-margin HBM and server DDR5 over standard parts.

For procurement teams without locked-in allocations, this means three things: prices on memory you have to buy will keep rising through 2026, lead times on standard parts will get worse before they get better, and the open market — independent brokers, surplus inventory, secondary-market suppliers — is now an unavoidable part of the sourcing strategy.

American Microelectronics sources DDR4, DDR5, LPDDR, NAND, NOR, SRAM, and eMMC across Samsung, Micron, SK Hynix, Winbond, ISSI, and GigaDevice. Independent testing through Global ETS or Whitehorse Labs, backed by our warranty.

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