EV and Industrial Power Designs Driving 30+ Week Lead Times
Silicon carbide (SiC) MOSFET demand from EV powertrain and industrial power conversion has pushed lead times on Infineon CoolSiC, onsemi EliteSiC, and ROHM SCT-series parts past 30 weeks in 2026. Mature-node power semiconductors generally — IGBTs, standard MOSFETs, gate drivers — are also seeing extended delays as wafer capacity gets reallocated to advanced nodes.
The industry-wide capacity story in power semis is straightforward: high-margin advanced-node logic (for AI, mobile, data center) is consuming wafer starts, while mature-node power and analog capacity isn't growing fast enough to keep up with EV, renewable energy, and industrial automation demand. Eighteen new fab projects globally won't reach full operational capacity until 2027 or later.
For production builds that depend on specific Infineon OptiMOS, CoolMOS, or CoolSiC parts, on onsemi NTMFS or EliteSiC, on Vishay Siliconix, or on ROHM SCT MOSFETs, the practical implication is: source ahead of need, qualify alternates from Alpha & Omega and Toshiba as backup, and use the open market when allocation windows close on you.
American Microelectronics sources MOSFETs, IGBTs, gate drivers, and power modules across Infineon, onsemi, Vishay, ROHM, Toshiba, Alpha & Omega, and Nexperia. Send us a part number or full BOM — 24-hour response.